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Industry NewsNews > Industry News > How to control the amount of PCBA processing flux    

How to control the amount of PCBA processing flux

Hits:1  Add Date:2022/5/14

In  PCBA processing, many engineers are struggling to control the amount of flux used. But in order to obtain good soldering performance, sometimes a larger amount of flux is required in the selective soldering process, because engineers are often concerned with soldering results and not flux residues.


Most flux systems use a dispenser. To avoid a stability risk, the flux chosen for selective soldering should be one that remains inert when inactive -- that is, inactive.


Applying a lot of flux will give it the potential risk of leaching into the SMD area and creating residues. There are some important parameters in the soldering process that will affect the stability, the key is: the non-open part is formed when the flux penetrates into the SMD or other process temperature is lower. Although it may not have a bad effect on soldering in the process, when the product is in use, the unopened part of the flux combined with the humidity can cause electromigration, making the expansion performance of the flux a critical parameter.



A new development in flux in selective soldering is to increase the solids content of the flux so that a higher solids solder can be formed by applying a smaller amount of flux. Typically soldering processes require 500-2000μg/in2 of flux solids. In addition to the fact that the amount of flux can be controlled by adjusting the parameters of the welding equipment, the actual situation may be complicated. Flux spreading properties are important to its stability, because the total amount of solids after the flux dries can affect the quality of the solder.

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